A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology

Ou, Y; Qu, F; Wang, G; Nie, M; Li, Z; Ou, W; Xie, C; (2016) A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology. Applied Physics Letters , 109 (2) 10.1063/1.4958842 . Green open access

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